Munich, Germany, 15 March 2023 – At embedded world 2023 (Hall 3, Booth 357), MicroSys Electronics will be presenting an evaluation kit for its miriac System-on-Modules based on NXP Semiconductors’ S32G processor family. Deployed in vehicle networks as headless controllers, these highly integrated and performance scalable processors support ADAS and other functions for increasingly autonomous vehicles. Developers can use the new miriac evaluation platform, which is designed as a modular single board computer (SBC), to test the performance balancing of their applications and to connect their CAN-, LIN-, FlexRay- and 100BASE-T1-based peripherals via automotive connectors. The evaluation kit includes NXP S32G274A and/or new NXP S32G399A based miriac System-on-Modules, a carrier board in the shape of a dedicated modular SBC, as well as the appropriate power supply, cable sets and a pre-installed Linux image.
Developers of mixed-critical safety applications benefit from up to eight Arm Cortex-A53 cores and four Arm Cortex-M7 dual-core lockstep pairs. This is sufficient to process LiDAR and video data alongside functionally safe vehicle control. When extended with one or two Hailo-8 AI processor modules, the evaluation kit also provides numerous pre-trained computer vision models for situational awareness. OEMs using such application ready System-on-Module based platforms – for which MicroSys also develops certification ready system designs – gain access to rapid prototyping, advanced connectivity for their specific use cases, comprehensive software support, and documentation required for safety certification up to ASIL D. Target markets are real-time connected and increasingly autonomous vehicles, all types of mobile machines, as well as automotive test and measurement equipment.
The new miriac SBC-S32G399A based evaluation kit is available now. For more information, please visit: https://www.microsys.de/en/products/sbc/arm-architecture/miriacr-sbc-s32g399a/